This project aimed to adapt the Thermostream system for use within a high-voltage test enclosure, enabling evaluation board testing under combined high-voltage and high-temperature conditions.

An inner and outer plenum assembly was designed and 3D printed using high-temperature PETG to prevent material softening during operation. Gasket material was applied at the interface between the evaluation board and the outer plenum to protect sensitive components from compression while forming a hermetic seal that minimized temperature fluctuations affecting non-critical areas. Airflow was directed through the plenum to a vent located on the Thermostream head, with temperature continuously monitored via thermocouple.

To further ensure thermal stability, the plenum infill pattern was designed to allow filling with thermally insulative resin if additional insulation was required to protect the external environment from temperature variation.